ROBOTECH Yana Taimakawa Masana'antar Semiconductor Gane Tsarin Dabarun Dabaru

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Semiconductor chips su ne ginshiƙan ginshiƙan fasahar bayanai da kuma muhimmiyar fasaha da masana'antu da ke tasowa waɗanda ƙasashe ke fafatawa don haɓakawa.Wafer, a matsayin muhimmin abu na kera kwakwalwan na'ura na semiconductor, yana taka muhimmiyar rawa wajen bunkasa masana'antar sarrafa na'ura ta kasar Sin.Dangane da karfin kera wafer, kasar Sin ta riga ta zama kan gaba a duniya, amma yayin da "karancin guntu" ya karu a duniya, za ta kara habaka karfin iya aiki.

1. Fagen Aikin
Wani reshe na masana'antar semiconductor na cikin gida da aka jera rukuni, a matsayin babban ɗan wasa a cikin masana'antar bayanan lantarki ta ƙasa, ta himmatu ga bincike da haɓakawa, kera kayan semiconductor, ƙwararrun kayan lantarki, na'urorin semiconductor da sauran fasaha.Babban samfurin shine yankin semiconductor yana narkewa guda kristal silicon wafer, tare da babban babban ƙarfi uku na duniya da rabon kasuwar cikin gida.fiye da 80%.

Don haɓaka haɓaka iya aiki, kamfanin ya kashe kusan dala biliyan 3 don fara aikin samar da babban diamita na wafer silicon da aikin kera don haɗaɗɗun da'irori a cikin birnin Yixing, Lardin Jiangsu.An kaddamar da kashi na biyu na aikin a shekarar 2021, tare da bin tsarin ci gaba na "Industry 4.0" da kuma shirin yin amfani da fasahar kere-kere a duk fadin layin don cimma aikin sarrafa kansa, ba da labari, da basirar gina taron.Bayan kammalawa, jimlar yawan ƙarfin samarwa zai zama 220000 8-inch epitaxial wafers, 200000 12-inch goge wafers, da 150000 12-inch epitaxial wafers kowace wata, zama tushen samar da wafer silicon tare da fa'idodin duniya.Don haka, ta fuskar taskace waqoqi na qungiyan.ROBOTECH ya inganta hazaka, ba da labari, da matakin sarrafa kansa na tushen samar da shi ta hanyar aiwatar da ingantattun tsare-tsaren ajiya na hankali..

2. Projectplanning
ROBOTECH ya yi cikakken amfani da sararin tsaye na 6m na tushen samar da shi kuma ya tsara waniAkwatin akwatin 4-lane mai sarrafa kansadon samun damar samfuran wafer semiconductor, wanda zai iya ɗaukar jimlar sama da dukaWuraren ajiya 2000, yadda ya kamata kara yawan ajiya iya aiki na wafers.Saboda kasancewar wafer a cikin sigar takarda, mai ɗaukarsa yana ɗaukar akwati na filastik na musamman na 330 * 330 * 300 don sauƙin shiga wafer, tare da matsakaicin nauyin 50kg.An warware matsalar hadaddun hanyoyin ajiyar wafer da ƙarancin amfani da sararin samaniya a cikin ɗakunan ajiya na gargajiya, da samun ci gaba biyu a cikin amfani da sararin samaniya da inganci.

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• Tsarin alkiblar ma'auni na crane
• 100m / min & 24-hour samar da kari & 63P / h ta sake zagayowar

Dangane da ingantaccen aiki, ROBOTECH yana zaɓarjerin zebra stackercranetsarindon kwararar kayan abu mai ƙarfi, tare da saurin kwance100m/min, wanda ya hadu da24-hour samarwa karina samar da tushe, da kuma iyawar ajiya iya isa63P/h a kowace zagaye.

3. Rashin jin tsoron ƙalubale, ƙirƙira na musamman

Etabbatar kura da juriya
Ƙimar da ba daidai ba
Una'urar firikwensin ultrasonic
Tan sanya shi mai ɗaukar kaya a kusurwar digiri 5 akan ɗakunan ajiya da cokula masu yatsa

Kalubale 1
Halayen ajiya na semiconductor wafers shine zuwatabbatar da kura da juriya, in ba haka ba yana da sauƙi don haifar da lalacewa ga wafers masu rauni.Dangane da wannan, ROBOTECH ya haɓaka tsarin injina na crane stacker zuwagyare-gyaren da ba daidai ba.Misali, ana amfani da rails na kasa na aluminum a maimakon na al'ada, ana amfani da ginshiƙan ginshiƙan gami da ƙarfin sanyi mai ƙarfi maimakon ginshiƙan ƙarfe, ana amfani da ƙafafun da aka rufe da roba maimakon ƙafafun ƙarfe, ana amfani da ɗaga bel maimakon ɗaga igiya na ƙarfe na ƙarfe. , kuma ana ƙara murfi mai hana ƙura zuwa dandamalin kaya.Tun daga farkon tsarin ƙirar kayan aiki, an rage tasirin ƙura da girgiza akan kaya, an rage haɗarin gurɓataccen gurɓataccen iska a cikin bitar ba tare da ƙura ba,kuma an inganta yawan amfanin ƙasa.Matakan tsafta na iya biyan buƙatun muhalli na Class 1000.

Kalubale 2
Saboda fataccen akwatin filastik na mai ɗaukar wafer, ba za a iya amfani da na'urori masu auna firikwensin hoto na al'ada ba don gano kaya.ROBOTECH da ƙirƙira wani sabon abuna'urar firikwensin ultrasonicdon gano kaya, wanda zai iya gano yanayin kaya ta atomatik akan shelves da pallets.Kuma an sanye shi da kyamara da allon aikin hannu na hannu don cimma ingantacciyar gani da gano duk wani abu a duk tsawon aikin, tare da magance matsala da warware kurakurai ta hanya mafi dacewa.

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Kalubale
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Don hana wafer daga zamewa daga mai ɗaukar kaya.an sanya mai ɗaukar kaya a kusurwar digiri 5 akan ɗakunan ajiya da cokali mai yatsa.Ana samun madaidaicin madaidaicin matsayi da cokali mai ɗorewa ta hanyar saka ramin ƙasa na akwatin wafer a cikin madaidaitan madaidaicin kayan aiki guda uku na kayan aiki na musamman don tara dandamalin jigilar iska don ajiya.Bayan maimaita gwaji, daidaiton matsayi na ƙarshe ya kai± 2mm ku, kuma santsi ya kai99.99%.Bugu da ƙari, kayan aiki suna ɗaukar na'urori masu haɗaka daban-daban, inganta ingantaccen gabaɗayakwanciyar hankali da aminci factor.

 

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A matsayin ƙwararren masani a cikin hanyoyin warewar ajiya na atomatik, ROBOTECH ya gina hanyoyin dabarun dabaru.don kayan wafer waɗanda ba su da gurɓatawa kuma ana iya gano su a cikin ainihin lokaci, bisa ga kayan aiki na ci gaba da cikakkun tsarin.

Nasarar aiwatar da wannan aikin ya nuna alamaingantacciyar nasara a cikin ma'ajin wafer na semiconductor mai sarrafa kansa, kuma yana nufin hakaROBOTECH za ta shiga filin semiconductor a hukumance, ƙarfafa masana'antun semiconductor tare da mafita mai sarrafa kayan aiki na hankali.A nan gaba, ROBOTECH za ta ci gaba da bincike, tara ilimin masana'antu, inganta amfani da albarkatu, da samun ci gaba mai inganci.

 

 

 

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Lokacin aikawa: Afrilu-11-2023

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